Production capabilities
When designing a PCB layout, engineer should know perfectly the technological capabilities of production where the PCB will be produced. Compliance of layout with the technological standards ensures the quality and reliability of finished PCBs. Especially it is very important in case of series production of PCBs. To secure your orders we strongly recommend to check and follow the technological parameters given below.
For your convenience, we put the most important technological parameters into the table:
|
Common parameters (single-, double- and multilayer printed circuit boards) |
Value |
|
Board thickness, mm |
0,4-3,2 |
|
Copper thickness, μm |
9, 18, 35, 70, 1051 |
|
Maximum PCB dimensions, mm |
550,0 х 1150,0 |
|
Material |
FR1, FR2, FR4, CEM1, CEM3, halogen free; with index of CTI ≥ 400, ≥600; for RF and microwave freq. range (Rogers, Arlon); high Tg materials – up to 175 0C; metal core and other. 2 |
|
PCB outline processing |
routing, scoring (V-cut), punching |
|
Surface finishing |
HAL RoHS (Lead free), HAL SnPb, Immersion gold (ENIG), Immersion Tin, Gold Flash, Gold Fingers, carbone, OSP |
|
Legend colour |
white, black, yellow, green 3 |
|
Solder mask colour |
green, white, black (glossy and matte), red, blue 3 |
|
Parameters |
Recommended value |
Limit value |
|
Multilayer PCB |
||
|
Number of layers |
4-14 |
4-28 |
|
Minimal conductor width4, mm |
0,1 |
0,076 |
|
Minimal conductors space4, mm |
0,1 |
0,076 |
|
Minimal space between conductor and board’s outline (outer layers / inner layers), mm |
0,5/0,5 |
0,3/0,5 |
|
Minimal hole size (mechanical drilling)6, mm |
0,2 |
0,2 |
|
Aspect ratio |
1:8 |
1:12 |
|
Minimal annular ring5, mm |
0,15 |
0,127 |
|
Blind vias |
yes |
yes |
|
Buried vias |
yes |
yes |
|
Minimal solder mask swell, mm |
0,05 |
0,05 |
|
Minimal solder mask bridge, mm |
0,1 |
0,1 |
|
Legend width (silkscreen), mm |
- |
0,1 |
|
Minimal legend symbol height (silkscreen), mm |
1,0 |
0,7 |
|
Multilayer HDI PCB |
||
|
Number of layers |
4-16 |
4-28 |
|
Build-up |
3-N-3 |
4-N-4 |
|
Minimal conductor width4, mm |
0,1 |
0,076 |
|
Minimal conductors space4 (outer layers / inner layers), mm |
0,1/0,076 |
0,076/0,064 |
|
Minimal space between conductor and board’s outline (outer layers / inner layers), mm |
0,5/0,5 |
0,3/0,5 |
|
Minimal hole size (laser drilling), mm |
0,1 |
0,075 |
|
Minimal annular ring5 (outer layers / inner layers), mm |
0,15/0,1 |
0,127/0,1 |
|
Via-in-pad technology |
yes |
yes |
|
Stacked and staggered micro vias |
yes |
yes |
|
Copper plugged vias |
yes |
yes |
|
Resin plugged vias |
yes |
yes |
|
Minimal solder mask swell, mm |
0,05 |
0,025 |
|
Minimal solder mask bridge, mm |
0,1 |
0,1 |
|
Double sided PCB |
||
|
Minimal conductor width4, mm |
0,15 |
0,1 |
|
Minimal conductors space4, mm |
0,15 |
0,1 |
|
Minimal space between conductor and board’s outline, mm |
0,5 |
0,3 |
|
Minimal hole size, mm |
0,3 |
0,2 |
|
Aspect ratio |
1:8 |
1:12 |
|
Minimal annular ring5, mm |
0,2 |
0,15 |
|
Minimal solder mask swell, mm |
0,1 |
0,05 |
|
Minimal solder mask bridge, mm |
0,15 |
0,1 |
|
Legend width (silkscreen), mm |
- |
0,1 |
|
Minimal legend symbol height (silkscreen), mm |
1,0 |
0,7 |
|
Single sided PCB |
||
|
Minimal conductor width4, mm |
0,2 |
0,15 |
|
Minimal conductors space4, mm |
0,2 |
0,15 |
|
Minimal space between conductor and board’s outline, mm |
0,5 |
0,3 |
|
Minimal hole size, mm |
0,5 |
0,4 |
|
Minimal annular ring5, mm |
0,3 |
0,2 |
|
Minimal solder mask swell, mm |
0,1 |
0,05 |
|
Minimal solder mask bridge, mm |
0,2 |
0,1 |
|
Legend width (silkscreen), mm |
- |
0,1 |
|
Minimal legend symbol height (silkscreen), mm |
1,5 |
1,0 |
|
Flex PCB |
||
|
Number of layers |
1-6 |
|
|
Material |
Polyimide, PET |
|
|
Minimal conductor width4, mm |
0,15 |
0,1 |
|
Minimal conductors space4, mm |
0,15 |
0,1 |
|
Minimal space between conductor and board’s outline, mm |
0,5 |
0,25 |
|
Minimal hole size, mm |
0,3 |
0,2 |
|
Coverlay swell (coverlay to soldering pad gap), mm |
0,2 |
0,1 |
|
Aluminum core PCB |
||
|
Number of layers |
1-2 |
1-4 |
|
Board thickness, mm |
0,5-3,2 |
|
|
Copper thickness, μm |
35 |
|
|
Dielectric thickness, μm |
50, 75, 100, 150 |
|
|
Thermal conductivity, W/mK |
0,7-4 |
|
|
Breakdown voltage, kV |
2-12 |
|
|
Maksimum PCB dimensions, mm |
550,0 х 950,0 |
|
|
Material |
AL 5052 |
|
|
Minimal conductor width4, mm |
0,2 |
0,15 |
|
Minimal conductors space4, mm |
0,2 |
0,15 |
|
Minimal space between conductor and board’s outline, mm |
0,5 |
0,25 |
|
Minimal hole size, mm |
0,9 |
0,6 |
|
Minimal solder mask swell, mm |
0,15 |
0,05 |
1 It is possible to make thicker copper on demand.
2 Other materials on demand.
3 Other colours on demand.
4 For copper thickness 9 μm and 18 μm.
5 (Pad size – hole size)/2
6 It is possble to use laser drilling on demand.
Here comes the golden rule: in the PCB design one should use the recommended parameters wherever it is possible instead of limit values. Limit values should be used only when there is no other way.
In other words, if after completing the layout there is still a place to widen or increase some tracks, spaces or vias diameters it is better to do so, of course if it is not in conflict with the electrical properties of the circuit. Such an approach to the layout design allows to improve the PCB reliability and makes it more cost effective.