Technical guides

Electronics Design and Manufacturing Series

In the first issue of our technical guides "Electronics Design and Manufacturing Series" we presented the main points that should be taken into account purchasing and using the electronic components. We hope that they will prove useful for designers and supply departments that deal with Bill of Materials (BOM). The second and third issues provide information on the planning of layer stack-ups in multilayer printed circuits. The fourth issue is devoted to the PCB layout design, production preparation and material selection.

Download the technical guides below:

Guide to Electronic Components

Guide I (Part 1)

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Guide to Electronic Components

Guide I (Part 2)

Coming soon

Guide to Stack-up Planning

Guide II

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Guide to HDI Build-up Planning

Guide III

Download pdf

Guide to Printed Circuit Boards

Guide IV

Download pdf

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