Production equipment
Our production equipment forms a key part of the electronics manufacturing process, enabling us to deliver projects with a high level of quality, precision, and repeatability. By utilizing advanced technologies and specialized machinery, we are able to efficiently carry out every stage of the assembly process — from solder paste application and precise component placement to reflow soldering and comprehensive quality inspectioni.
Our carefully selected and continuously upgraded production equipment allows us to adapt flexibly to customer requirements while ensuring the reliability and consistency of the final products. This investment in modern manufacturing capabilities enables us to maintain high production standards, optimize efficiency, and deliver dependable electronic assemblies for a wide range of applications.
Yamaha YCP10 Solder Paste Printer
The Yamaha YCP10 is a state-of-the-art, fully automated solder paste printer designed to deliver exceptional printing accuracy and process repeatability, even for the smallest PCB pad geometries. Its advanced technological solutions ensure stable production performance and consistently high-quality solder paste deposition.
Key Features and Specifications:
- Positioning accuracy: ±0.010 mm
- Supported PCB sizes: 50 × 50 mm to 510 × 460 mm
- Stencil size range: 300 × 300 mm to 736 × 736 mm
- Integrated 2D post-print inspection
- Automatic stencil cleaning and calibration system
The YCP10 is equipped with Yamaha’s intelligent print process control system. Its innovative 3S print head automatically adjusts squeegee attack angle and printing speed according to the characteristics of the solder paste and the required deposit volume. This enables optimal print quality and process stability, including demanding Pin-in-Paste applications.
To further enhance process control, the machine features a laser-based solder paste roll height measurement system, which continuously monitors paste volume during production. This ensures consistent solder paste deposition across every PCB panel, even during long production runs, helping to maintain high yield rates and reliable assembly quality.
By combining precision mechanics, advanced automation, and real-time process monitoring, the Yamaha YCP10 provides a solid foundation for high-quality SMT manufacturing and supports the production of increasingly complex electronic assemblies.
Yamaha YSM20R Pick-and-Place Machine
The Yamaha YSM20R is an ultra-high-speed pick-and-place machine designed for both prototype and high-volume production. Combining exceptional placement speed with outstanding flexibility, it provides a versatile solution for a wide range of assembly requirements — from miniature passive components to large and complex electronic devices.
Key Features and Specifications:
- Placement accuracy: ±0.025 mm
- Minimum component size: 01005 (0.4 × 0.2 mm)
- Supported PCB dimensions: 50 × 50 mm to 810 × 490 mm
- Placement speed: up to 95,000 CPH (approximately 70,000 CPH in real production conditions)
- Dual independent placement gantries
- Supports tape feeders, JEDEC trays, and stick feeders
- Integrated 3D component recognition and placement correction system
- Coplanarity inspection of component leads prior to placement
The YSM20R supports an exceptionally wide range of components, from ultra-miniature 01005 packages to devices measuring up to 100 × 100 mm. This versatility makes it an ideal solution for diverse manufacturing environments and product requirements.
Advanced vision systems and highly accurate positioning technology significantly reduce the risk of placement errors, helping to minimize defects and improve overall product quality. The machine continuously verifies component orientation, dimensions, and placement accuracy, ensuring reliable and repeatable assembly results.
Thanks to its combination of speed, precision, and flexibility, the Yamaha YSM20R is perfectly suited for both rapid prototype builds and large-scale production runs, delivering the efficiency and reliability required in modern electronics manufacturing.
Heller 1913 MK7 Reflow Oven
The Heller 1913 MK7 is an advanced convection reflow oven designed for SMT soldering applications. Engineered to deliver exceptional process control and production efficiency, it provides the reliability and consistency required for modern electronics manufacturing.
Key Features and Specifications:
- 13 heating zones (top and bottom) + 3 cooling zones
- Temperature stability: ±1°C
- Compatible with both lead-free and leaded soldering processes
The oven's 13 independently controlled heating zones enable precise thermal profile development and optimization, which is essential for soldering demanding components such as BGAs, QFNs, and other advanced package types.
Accurate and stable temperature control helps minimize thermal stress, reducing the risk of defects such as warpage, delamination, and solder joint failures. This results in improved process reliability and consistently high-quality solder connections.
Designed for continuous production environments, the Heller 1913 MK7 ensures excellent repeatability across production runs while maintaining optimal soldering conditions for a wide variety of PCB assemblies. Its proven performance makes it an ideal solution for both medium- and high-volume manufacturing, where process consistency and product reliability are critical.
By combining advanced thermal management, robust process control, and high production throughput, the Heller 1913 MK7 plays a vital role in delivering reliable, high-quality electronic assemblies.
Yamaha YSi-V AOI System
The Yamaha YSi-V is an advanced Automated Optical Inspection (AOI) system that combines both 2D and 3D inspection technologies to provide comprehensive quality control after the assembly process. Designed to detect even the smallest manufacturing defects, it plays a critical role in ensuring product reliability and maintaining the highest quality standards in electronics production.
Key Features and Specifications:
- Camera resolution: up to 12 megapixels
- Minimum inspected component size: 01005
- 3D inspection with solder joint volume analysis
- Detection of defects such as: Incorrect polarity, misalignment and displacement, solder bridges and shorts, ombstoning effects, missing or incorrect components as well as other assembly-related defects
By combining high-resolution 2D imaging with advanced 3D measurement capabilities, the Yamaha YSi-V not only verifies component presence and placement accuracy but also performs detailed analysis of solder joint shape, height, and volume. This enables the detection of defects that may be difficult or impossible to identify using conventional inspection methods, including micro-cracks, insufficient solder wetting, and hidden soldering issues.
The system provides immediate feedback to operators and process engineers, enabling rapid corrective actions and continuous process optimization. Early defect detection reduces the risk of faulty products progressing through production, improving overall yield and minimizing rework costs.
By automating the inspection process, the Yamaha YSi-V significantly reduces the need for manual visual inspection, saving time and resources while delivering consistent, objective, and highly reliable quality control. As a result, it serves as a vital component in maintaining the highest standards of electronics manufacturing.
PCB Depaneling Equipment
PCB depaneling, the process of separating individual circuit boards from larger production panels, is a critical stage of the manufacturing process. The quality of this operation directly affects the final appearance of the product, the integrity of mounted components, and the reduction of risks associated with micro-cracks, mechanical stress, and PCB trace damage.
By matching the depaneling process to the specific requirements of each project, we minimize mechanical stress on assembled boards and sensitive electronic components. This approach helps maintain product quality, improves manufacturing reliability, and reduces the likelihood of defects that could impact long-term performance.
Our flexible depaneling capabilities support both prototype and high-volume production, ensuring efficient processing while preserving the highest standards of workmanship and product integrity.
CAB Maestro 2M PCB Depaneling System
The CAB Maestro 2M is a semi-automatic PCB depaneling system equipped with a circular blade, motorized drive, and lower board support, designed for precise straight-line separation of printed circuit boards from production panels.
Key Features and Specifications:
- Suitable for both FR4 and aluminum PCB panels
- Maximum PCB length: up to 450 mm
- Full-length guide system for stable and safe operation
- Minimized risk of damage to components, solder joints, and PCB traces
The Maestro 2M provides a reliable and efficient depaneling solution for applications requiring high cutting quality and consistent results. Its precision-guided cutting mechanism minimizes mechanical stress during separation, helping to protect sensitive electronic components and maintain PCB structural integrity.
The machine is particularly well suited for low- and medium-volume production, where flexibility, ease of use, and dependable performance are essential. By combining simple operation with accurate cutting technology, the CAB Maestro 2M ensures clean board edges and a professional final product appearance while reducing the risk of manufacturing defects caused by improper depaneling.
CAB Separator Hektor 2 PCB Depaneling System
The CAB Separator Hektor 2 is a compact, fully automated PCB depaneling system designed for precise separation of assembled circuit boards from production panels. Engineered to deliver consistent results with minimal mechanical stress, it ensures safe and reliable processing of populated PCBs.
Key Features and Specifications:
- High-precision panel separation
- Adjustable cutting parameters
- Excellent process repeatability
- Minimized mechanical stress on PCBs and components
The Hektor 2 automates the depaneling process, eliminating many of the risks associated with manual board separation. Its precise cutting mechanism helps prevent damage to sensitive electronic components, solder joints, and PCB traces, ensuring the integrity of the finished assembly.
Piergiacomi DPF 300 PCB Routing System
The Piergiacomi DPF 300 is a vertical multi-spindle PCB routing system with programmable control, specifically designed for depaneling printed circuit boards with irregular shapes and complex contours. Using routing technology instead of blade-based cutting, it provides exceptional flexibility and precision for demanding PCB designs.
Key Features and Specifications:
- Routing technology for complex and irregular PCB shapes
- Programmable operation for repeatable and accurate processing
- Minimized mechanical stress during depaneling
- Vibration-free operation for maximum component protection
Unlike conventional blade-based depaneling methods, the DPF 300 uses precision milling technology to separate individual PCBs from production panels. This approach allows for the processing of intricate board outlines while maintaining excellent edge quality and dimensional accuracy.
The Piergiacomi DPF 300 is particularly well suited for assemblies with complex geometries, densely populated boards, and applications where maximum product reliability is required. By incorporating multiple depaneling technologies within our production facility, we are able to select the most appropriate process for each project, ensuring superior product quality, manufacturing efficiency, and long-term reliability of the finished electronic assemblies.
iTECH PPM-A320VC Semi-Automatic SMT Placement Machine
The iTECH PPM-A320VC is a semi-automatic SMT placement machine designed for applications that require maximum flexibility, rapid turnaround times, and efficient production of small batches. While it is not the primary placement system within our production line, it plays an important supporting role by enabling fast prototyping and low-volume manufacturing without interrupting high-volume production processes.
The machine is primarily used for:
- Prototype PCB assembly,
- Pre-production builds and design validation,
- Projects that do not justify setup of the main SMT production line.
Key Features and Specifications:
- Placement accuracy: up to ±0.025 mm, suitable for precision components including QFN, BGA, 0402, and similar packages
- Two placement heads with 360° rotation for increased flexibility and productivity
- Four CCD cameras for reliable component and PCB recognition
- Support for up to 54 feeders, enabling efficient handling of a wide range of component types
The iTECH PPM-A320VC combines high placement accuracy with flexible operation, making it an ideal solution for prototype development and short production runs. Its advanced vision system ensures accurate component alignment and placement, while the dual-head configuration improves assembly efficiency.
The iTECH PPM-A320VC serves as a valuable complement to our fully automated SMT line, enabling seamless support for product development, prototyping, and specialized low-volume manufacturing projects.
WDS-620 Wisdomshow Rework Station
The WDS-620 Wisdomshow is an advanced rework station designed for precision electronics repair and rework applications. Engineered to handle complex assemblies and large-format PCBs, it enables the safe and accurate replacement of advanced electronic components while maintaining the integrity of both the board and surrounding devices.
Key Features and Specifications:
- Supports PCB sizes up to 480 × 370 mm
- High-power upper IR heater: 1200 W
- Multi-zone bottom heating system: two-zone 1200 W heater and three-zone 2700 W heater
- Split-vision alignment system with dual HD cameras
- Three temperature measurement channels with ±1°C accuracy
- Suitable for precise replacement of BGA, QFN, LGA, CSP, and other advanced package types
The WDS-620 incorporates a sophisticated thermal management system that provides precise control of heating profiles throughout the rework process. Multiple independently controlled heating zones ensure uniform heat distribution, minimizing thermal stress and reducing the risk of PCB warpage or component damage.
Its advanced split-vision alignment system uses two high-definition cameras to achieve highly accurate component positioning prior to placement. This technology allows operators to align replacement components with exceptional precision, ensuring reliable solder joint formation and successful rework of fine-pitch devices.
The station is particularly valuable for servicing complex electronic assemblies and performing engineering modifications, repairs, and component replacements that require a high level of accuracy. Whether used for production support, failure analysis, or repair operations, the WDS-620 provides the precision and process control necessary to maintain the highest standards of electronics manufacturing quality.
As an essential part of our manufacturing and service capabilities, the WDS-620 enables efficient rework and repair processes while helping to maximize product reliability and production yield.
Weller WXR-3 Soldering Stations with Professional Tooling
The Weller WXR-3 power unit is an advanced, multifunctional soldering platform designed for precision assembly and electronics repair applications. Thanks to its compatibility with a wide range of professional tools, it enables various operations required in electronics manufacturing and service processes.
Key Features and Specifications:
- Power output: 420 W
- Simultaneous operation of multiple soldering tools
- Precise temperature control ensuring the safety of electronic components
Available Tooling:
- WXP120 and WXP65 soldering irons
- WXMT MS thermal tweezers – for the assembly and removal of small SMD components
- WXHAP200 hot air tool – for working with components and assemblies requiring hot air heating
- WXDP120 desoldering tool – for efficient solder removal
- WXMP Micro Soldering Set – for highly precise soldering applications
- WVP vacuum pickup tool – for safe handling and positioning of electronic components
The combination of advanced soldering equipment and specialized tooling allows for efficient execution of a wide range of assembly, repair, and rework operations. Precise temperature control and professional-grade tools help ensure high-quality workmanship while protecting sensitive electronic components throughout the process.
Visual Inspection Equipment
Manual visual inspection remains an important part of the quality control process, particularly for manually assembled components and for verifying details that may be difficult to evaluate using automated inspection systems. This process is carried out using specialized optical equipment, ensuring a high level of inspection accuracy.
Visual inspection serves as a valuable complement to automated quality control systems, helping to ensure that every assembled product meets the required manufacturing and quality standards
The following equipment is used for manual visual inspection:
Vision LUXO WAVE LED ESD / LED UV Magnifier
A professional inspection magnifier designed for precise visual inspection tasks, equipped with an advanced lighting system.
Key Features:
- 5-diopter optical lens measuring 171 × 114 mm, providing accurate and comfortable inspection
- Two dimmable LED modules, each with a power output of 6 W
- Illumination intensity: 4,600 lux at a working distance of 279 mm
- Color temperature: 4000 K (CCT)
- Color Rendering Index (CRI): Ra 80
- Additional UV lighting module with a wavelength of 360 nm
Andostar AD409 Pro Digital Microscope
A modern digital microscope designed for detailed component analysis and inspection documentation.
Key Features and Specifications:
- 10.1-inch LCD display with HDMI output
- Image capture resolution up to 24 MP (5600 × 4200, JPG format)
- Magnification up to 300×
- Minimum focusing distance: 5 cm
The use of these tools enables accurate assessment of assembly quality, detection of defects invisible to the naked eye, and comprehensive documentation of inspection results. Manual visual inspection complements automated inspection systems and helps ensure the highest level of final product quality..
SAHARA DRY 80VF Drying Oven
In electronics manufacturing, product quality depends not only on precise assembly and reliable soldering, but also on the proper preparation of components before production. Particular attention must be given to moisture-sensitive devices (MSDs) that have been stored outside their sealed packaging or whose moisture barrier bags have already been opened.
To address this requirement, we utilize the SAHARA DRY 80VF, an industrial drying oven specifically designed for the needs of electronics manufacturing.
Key Features and Specifications:
- Large capacity – allows entire batches of components to be dried simultaneously
- Stable temperature control – uniform heating up to 125°C without the risk of overheating
- Humidity control – maintains a low-moisture environment inside the chamber
- Compliance with IPC/JEDEC standards (including J-STD-033) for moisture-sensitive components with defined MSL ratings
The drying process performed by the SAHARA DRY 80VF plays a crucial role in ensuring reliable soldering results by eliminating moisture-related risks that can lead to hidden defects such as microcracks, delamination, and the so-called “popcorn effect” during reflow soldering.
This is particularly important for highly moisture-sensitive packages such as BGA, QFN, and other advanced semiconductor devices, where internal damage may be impossible to detect through visual inspection alone.
By ensuring that components meet the required moisture conditions before assembly, the SAHARA DRY 80VF helps improve production reliability, reduce manufacturing defects, and maintain the highest quality standards throughout the electronics manufacturing process.