Production capabilities

Production capabilities

An engineer must be proficient in the capabilities of the technological process based on which the board will be manufactured. Compliance with technological standards at the design phase of a printed circuit board ensures its subsequent high-quality and reliable production, enables high volumes to be produced by minimizing defects, and also ensures the reliable functioning of the devices where the PCB is used. The above allows to reduce cost on both the product introduction phase and its operational phase.

For your convenience, we put the most important technological parameters into the table:


Common parameters (single-, double- and multilayer printed circuit boards) Value

Board thickness, mm

0,4-3,2

Copper thickness, μm

9, 18, 35, 70, 1051

Maximum PCB dimensions, mm

550,0 х 1150,0

Material

FR1, FR2, FR4, CEM1, CEM3, halogen free; with index of CTI ≥ 400, ≥600; for RF and microwave freq. range (Rogers, Arlon); high Tg materials – up to 175 0C; metal core and other. 2

PCB outline processing

routing, scoring (V-cut), punching

Surface finishing

HAL RoHS (Lead free), HAL SnPb, Immersion gold (ENIG), Immersion Tin, Gold Flash, Gold Fingers, carbone, OSP

Legend colour

white, black, yellow, green 3

Solder mask colour

green, white, black (glossy and matte), red, blue 3



Parameters Typical Advanced

Multilayer PCB

Number of layers

4-14

4-28

Minimum conductor width4, mm

0,1

0,076

Minimum conductors space4, mm

0,1

0,076

Minimum space between conductor and board’s outline (outer layers / inner layers), mm

0,5/0,5

0,3/0,5

Minimum hole size (mechanical drilling)6, mm

0,2

0,2

Aspect ratio

1:8

1:12

Minimum annular ring5, mm

0,15

0,127

Blind vias

yes

yes

Buried vias

yes

yes

Minimum solder mask swell, mm

0,05

0,05

Minimum solder mask bridge, mm

0,1

0,1

Legend width (silkscreen), mm

-

0,1

Minimum legend symbol height (silkscreen), mm

1,0

0,7

Multilayer HDI PCB

Number of layers

4-16

4-28

Build-up

3-N-3

4-N-4

Minimum conductor width4, mm

0,1

0,076

Minimum conductors space4 (outer layers / inner layers), mm

0,1/0,076

0,076/0,064

Minimum space between conductor and board’s outline (outer layers / inner layers), mm

0,5/0,5

0,3/0,5

Minimum hole size (laser drilling), mm

0,1

0,075

Minimum annular ring5 (outer layers / inner layers), mm

0,15/0,1

0,127/0,1

Via-in-pad technology

yes

yes

Stacked and staggered micro vias

yes

yes

Copper plugged vias

yes

yes

Resin plugged vias

yes

yes

Minimum solder mask swell, mm

0,05

0,025

Minimum solder mask bridge, mm

0,1

0,1

Double sided PCB

Minimum conductor width4, mm

0,15

0,1

Minimum conductors space4, mm

0,15

0,1

Minimum space between conductor and board’s outline, mm

0,5

0,3

Minimum hole size, mm

0,3

0,2

Aspect ratio

1:8

1:12

Minimum annular ring5, mm

0,2

0,15

Minimum solder mask swell, mm

0,1

0,05

Minimum solder mask bridge, mm

0,15

0,1

Legend width (silkscreen), mm

-

0,1

Minimum legend symbol height (silkscreen), mm

1,0

0,7

Single sided PCB

Minimum conductor width4, mm

0,2

0,15

Minimum conductors space4, mm

0,2

0,15

Minimum space between conductor and board’s outline, mm

0,5

0,3

Minimum hole size, mm

0,5

0,4

Minimum annular ring5, mm

0,3

0,2

Minimum solder mask swell, mm

0,1

0,05

Minimum solder mask bridge, mm

0,2

0,1

Legend width (silkscreen), mm

-

0,1

Minimum legend symbol height (silkscreen), mm

1,5

1,0

Flex PCB

Number of layers

1-6

Material

Polyimide, PET

Minimum conductor width4, mm

0,15

0,1

Minimum conductors space4, mm

0,15

0,1

Minimum space between conductor and board’s outline, mm

0,5

0,25

Minimum hole size, mm

0,3

0,2

Coverlay swell (coverlay to soldering pad gap), mm

0,2

0,1

Aluminum core PCB

Number of layers

1-2

1-4

Board thickness, mm

0,5-3,2

Copper thickness, μm

35

Dielectric thickness, μm

50, 75, 100, 150

Thermal conductivity, W/mK

0,7-4

Breakdown voltage, kV

2-12

Maksimum PCB dimensions, mm

550,0 х 950,0

Material

AL 5052

Minimum conductor width4, mm

0,2

0,15

Minimum conductors space4, mm

0,2

0,15

Minimum space between conductor and board’s outline, mm

0,5

0,25

Minimal hole size, mm

0,9

0,6

Minimum solder mask swell, mm

0,15

0,05


1 It is possible to make thicker copper on demand.
2 Other materials on demand.
3 Other colours on demand.
4 For copper thickness 9 μm and 18 μm.
5 (Pad size – hole size)/2
6 It is possble to use laser drilling on demand.



Minimum clearances for different cooper thicknesses

Finished copper thickness, μm 35 70 105 140 210
Minimum Trace, mm 0,1 0,20 0,23 0,30 0,60
Minimum clearance, mm 0,1 0,20 0,24 0,35 0,70

Finished copper thickness, μm 35 70 105 140 210
Minimum Trace, mm 0,1 0,20 0,27 0,34 0,60
Minimum clearance, mm 0,1 0,20 0,30 0,45 0,85
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